E850-96 "All-In" Board is a 96Boards™CE HW Specification V2.0 Development Board 

based on Samsung Exynos 850 Mobile processor, developed by WinLink.

Exynos 850 is manufactured on 8nm low-power FinFET process design, 

high performance optimized Little Cortex-A55 Octa micro-processor 

for smart phone and tablet applications and also for embedded gadgets.

WinLink's "All-In" board is 100mm x 85mm in size, 96Boards™CE(Consumer Edition) Extended version

 including onboard NPU(Neural Processing Unit).